 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| NLAS5223B, NLAS5223BL Ultra-Low 0.5 W Dual SPDT Analog Switch The NLAS5223B is an advanced CMOS analog switch fabricated in Sub-micron silicon gate CMOS technology. The device is a dual Independent Single Pole Double Throw (SPDT) switch featuring Ultra-Low RON of 0.5 W, at VCC = 3.0 V. The part also features guaranteed Break Before Make (BBM) switching, assuring the switches never short the driver. Features http://onsemi.com MARKING DIAGRAM WQFN-10 CASE 488AQ 1 UQFN-10 CASE 488AT 1 XX XXMG G XXMG G * * * * * * * * * * * * * * * * * Ultra-Low RON, t0.5 W at VCC = 3.0 V NLAS5223B Interfaces with 2.8 V Chipset NLAS5223BL Interfaces with 1.8 V Chipset Single Supply Operation from 1.65-4.5 V Full 0-VCC Signal Handling Capability High Off-Channel Isolation Low Standby Current, t50 nA Low Distortion RON Flatness of 0.15 W High Continuous Current Capability $300 mA Through Each Switch Large Current Clamping Diodes at Analog Inputs $300 mA Continuous Current Capability Package: 1.4 x 1.8 x 0.75 mm WQFN-10 Pb-Free 1.4 x 1.8 x 0.55 mm UQFN-10 Pb-Free These are Pb-Free Devices M G = Specific Device Code AD = NLAS5223BMNR2G AE = NLAS5223BLMNR2G AP = NLAS5223BMUR2G = Date Code/Assembly Location = Pb-Free Device (Note: Microdot may be in either location) NC2 7 GND 6 IN2 8 5 NC1 Applications COM2 9 4 IN1 Cell Phone Audio Block Speaker and Earphone Switching Ring-Tone Chip / Amplifier Switching Modems NO2 10 3 COM1 1 VCC 2 NO1 FUNCTION TABLE IN 1, 2 0 1 NO 1, 2 OFF ON NC 1, 2 ON OFF ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 1 September, 2006 - Rev. 3 Publication Order Number: NLAS5223B/D NLAS5223B, NLAS5223BL COM NO NC IN Figure 1. Logic Equivalent Circuit PIN DESCRIPTION QFN PIN # 2, 5, 7, 10 4, 8 3, 9 6 1 Symbol NC1 to NC2, NO1 to NO2 IN1 and IN2 COM1 and COM2 GND VCC Independent Channels Controls Common Channels Ground (V) Positive Supply Voltage Name and Function http://onsemi.com 2 NLAS5223B, NLAS5223BL MAXIMUM RATINGS Symbol VCC VIS VIN Ianl1 Ianl-pk1 Iclmp Positive DC Supply Voltage Analog Input Voltage (VNO, VNC, or VCOM) Digital Select Input Voltage Continuous DC Current from COM to NC/NO Peak Current from COM to NC/NO, 10 Duty Cycle (Note 1) Continuous DC Current into COM/NO/NC with Respect to VCC or GND Parameter Value -0.5 to +5.5 -0.5 v VIS v VCC + 0.5 -0.5 v VIN v +5.5 300 500 100 Unit V V V mA mA mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Defined as 10% ON, 90% OFF Duty Cycle. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VIS TA tr, tf DC Supply Voltage Digital Select Input Voltage (OVT) Overvoltage Tolerance Analog Input Voltage (NC, NO, COM) Operating Temperature Range Input Rise or Fall Time, SELECT VCC = 1.6 V - 2.7 V VCC = 3.0 V - 4.5 V Parameter Min 1.65 GND GND -40 Max 4.5 4.5 VCC +85 20 10 Unit V V V C ns/V http://onsemi.com 3 NLAS5223B, NLAS5223BL NLAS5223B DC CHARACTERISTICS - DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol VIH VIL IIN IOFF ICC Parameter Minimum High-Level Input Voltage, Select Inputs Maximum Low-Level Input Voltage, Select Inputs Maximum Input Leakage Current, Select Inputs Power Off Leakage Current Maximum Quiescent Supply Current (Note 2) VIN = VCC or GND VIN = VCC or GND Select and VIS = VCC or GND Condition VCC 3.0 4.3 3.0 4.3 4.3 0 1.65 to 4.5 25C 1.4 2.0 0.7 0.8 0.1 0.5 1.0 -40C to +85C 1.4 2.0 0.7 0.8 1.0 2.0 2.0 Unit V V mA mA mA 2. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS5223B DC ELECTRICAL CHARACTERISTICS - ANALOG SECTION Guaranteed Maximum Limit 25C Symbol RON Parameter NC/NO On-Resistance (Note 3) NC/NO On-Resistance Flatness (Notes 3 and 4) On-Resistance Match Between Channels (Notes 3 and 5) Condition VIN = VIL or VIN = VIH VIS = GND to VCC ICOM = 100 mA ICOM = 100 mA VIS = 0 to VCC VIS = 1.5 V; ICOM = 100 mA VIS = 2.2 V; ICOM = 100 mA VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 4.0 V VIN = VIL or VIH VNO 0.3 V or 4.0 V with VNC floating or VNC 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V VCC 3.0 4.3 3.0 4.3 3.0 4.3 4.3 -5.0 Min Max 0.4 0.35 0.16 0.11 0.05 0.05 5.0 -50 -40C to +85C Min Max 0.5 0.4 0.20 0.14 0.05 0.05 50 nA Unit W RFLAT DRON W W INC(OFF) INO(OFF) ICOM(ON) NC or NO Off Leakage Current (Note 3) COM ON Leakage Current (Note 3) 4.3 -10 10 -100 100 nA 3. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 4. Flatness is defined as the difference between the maximum and minimum value of On-resistance as measured over the specified analog signal ranges. 5. DRON = RON(MAX) - RON(MIN) between NC1 and NC2 or between NO1 and NO2. http://onsemi.com 4 NLAS5223B, NLAS5223BL NLAS5223BL DC CHARACTERISTICS - DIGITAL SECTION (Voltages Referenced to GND) Guaranteed Limit Symbol VIH VIL IIN IOFF ICC Parameter Minimum High-Level Input Voltage, Select Inputs Maximum Low-Level Input Voltage, Select Inputs Maximum Input Leakage Current, Select Inputs Power Off Leakage Current Maximum Quiescent Supply Current (Note 6) VIN = 4.5 V or GND VIN = 4.5 V or GND Select and VIS = VCC or GND Condition VCC 3.0 4.3 3.0 4.3 4.3 0 1.65 to 4.5 25C 1.3 1.6 0.5 0.6 0.1 0.5 1.0 -40C to +85C 1.3 1.6 0.5 0.6 1.0 2.0 2.0 Unit V V mA mA mA 6. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. NLAS5223BL DC ELECTRICAL CHARACTERISTICS - ANALOG SECTION Guaranteed Maximum Limit 25C Symbol RON Parameter NC/NO On-Resistance (Note 7) NC/NO On-Resistance Flatness (Notes 7 and 8) On-Resistance Match Between Channels (Notes 7 and 9) Condition VIN = VIL or VIN = VIH VIS = GND to VCC ICOM = 100 mA ICOM = 100 mA VIS = 0 to VCC VIS = 1.5 V; ICOM = 100 mA VIS = 2.2 V; ICOM = 100 mA VIN = VIL or VIH VNO or VNC = 0.3 V VCOM = 4.0 V VIN = VIL or VIH VNO 0.3 V or 4.0 V with VNC floating or VNC 0.3 V or 4.0 V with VNO floating VCOM = 0.3 V or 4.0 V VCC 3.0 4.3 3.0 4.3 3.0 4.3 4.3 -10 Min Max 0.4 0.35 0.16 0.11 0.05 0.05 10 -100 -40C to +85C Min Max 0.5 0.4 0.20 0.14 0.05 0.05 100 nA Unit W RFLAT DRON W W INC(OFF) INO(OFF) ICOM(ON) NC or NO Off Leakage Current (Note 7) COM ON Leakage Current (Note 7) 4.3 -10 10 -100 100 nA 7. Guaranteed by design. Resistance measurements do not include test circuit or package resistance. 8. Flatness is defined as the difference between the maximum and minimum value of On-resistance as measured over the specified analog signal ranges. 9. DRON = RON(MAX) - RON(MIN) between NC1 and NC2 or between NO1 and NO2. http://onsemi.com 5 NLAS5223B, NLAS5223BL AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Guaranteed Maximum Limit VCC (V) 2.3 - 4.5 2.3 - 4.5 VIS (V) 1.5 1.5 25C Min Typ* Max 50 30 -40C to +85C Min Max 60 40 Unit ns ns ns 3.0 1.5 2 15 Symbol tON tOFF tBBM Parameter Turn-On Time Turn-Off Time Minimum Break-Before-Make Time Test Conditions RL = 50 W, CL = 35 pF (Figures 3 and 4) RL = 50 W, CL = 35 pF (Figures 3 and 4) VIS = 3.0 RL = 50 W, CL = 35 pF (Figure 2) Typical @ 25, VCC = 3.6 V CIN CNO/NC CCOM Control Pin Input Capacitance NO, NC Port Capacitance COM Port Capacitance When Switch is Enabled 3.5 60 200 pF pF pF *Typical Characteristics are at 25C. ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted) VCC (V) 1.65 - 4.5 25C Typical 19 Unit MHz Symbol BW Parameter Maximum On-Channel -3 dB Bandwidth or Minimum Frequency Response Maximum Feed-through On Loss Off-Channel Isolation Charge Injection Select Input to Common I/O Total Harmonic Distortion THD + Noise Channel-to-Channel Crosstalk Condition VIN centered between VCC and GND (Figure 5) VIN = 0 dBm @ 100 kHz to 50 MHz VIN centered between VCC and GND (Figure 5) f = 100 kHz; VIS = 1 V RMS; CL = 5.0 pF VIN centered between VCC and GND (Figure 5) VIN = VCC to GND, RIS = 0 W, CL = 1.0 nF Q = CL x DVOUT (Figure 6) FIS = 20 Hz to 20 kHz, RL = Rgen = 600 W, CL = 50 pF VIS = 2.0 V RMS f = 100 kHz; VIS = 1.0 V RMS, CL = 5.0 pF, RL = 50 W VIN centered between VCC and GND (Figure 5) VONL VISO Q THD VCT 1.65 - 4.5 1.65 - 4.5 1.65 - 4.5 3.0 1.65 - 4.5 -0.06 -68 38 0.08 -70 dB dB pC % dB 10. Off-Channel Isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to off switch. http://onsemi.com 6 NLAS5223B, NLAS5223BL DUT VCC 0.1 mF 50 W Output VOUT 35 pF 90% Output Input GND tBMM 90% of VOH VCC Switch Select Pin GND Figure 2. tBBM (Time Break-Before-Make) VCC DUT VCC 0.1 mF Open Output VOUT 50 W 35 pF Output VOL Input tON tOFF Input 0V VOH 90% 90% 50% 50% Figure 3. tON/tOFF VCC DUT Output Open 50 W VOUT 35 pF Input VCC 50% 0V VOH Output VOL 10% tOFF tON 10% 50% Input Figure 4. tON/tOFF http://onsemi.com 7 NLAS5223B, NLAS5223BL 50 W Reference Input Output 50 W Generator 50 W DUT Transmitted Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VONL = On Channel Loss = 20 Log VOUT VIN for VIN at 100 kHz VOUT for VIN at 100 kHz to 50 MHz VIN Bandwidth (BW) = the frequency 3 dB below VONL VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50 W Figure 5. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL DUT Open Output VIN VCC GND CL Output Off Off DVOUT VIN On Figure 6. Charge Injection: (Q) http://onsemi.com 8 NLAS5223B, NLAS5223BL 0 -10 -20 -30 XT (dB) BW (dB) -40 -50 -60 -70 -80 -90 -100 0.01 0.1 1 FREQUENCY (MHz) 10 100 -18 0.01 0.1 1 FREQUENCY (MHz) 10 100 -3 -6 -9 -12 -15 0 Figure 7. Cross Talk vs. Frequency @ VCC = 4.3 V 0.12 0.1 0.08 THD (%) RON (W) 0.06 0.04 0.02 0 10 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 100 1000 FREQUENCY (Hz) 10000 100000 0 0 Figure 8. Bandwidth vs. Frequency 85C 25C -40C 0.5 1 1.5 VIN (V) 2 2.5 3 Figure 9. Total Harmonic Distortion Figure 10. On-Resistance vs. Input Voltage @ VCC = 3.0 V 0.4 0.35 0.3 85C 0.25 RON (W) RON (W) 0.2 25C -40C 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0 0.5 1 1.5 2 VIN (V) 2.5 3 3.5 4 0.14 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 4.3 V 3.0 V 0.15 0.1 0.05 0 VIN (V) Figure 11. On-Resistance vs. Input Voltage @ VCC = 4.3 V Figure 12. On-Resistance vs. Input Voltage http://onsemi.com 9 NLAS5223B, NLAS5223BL ORDERING INFORMATION Device NLAS5223BMNR2G NLAS5223BLMNR2G NLAS5223BMUR2G Package WQFN-10 (Pb-Free) WQFN-10 (Pb-Free) UQFN-10 (Pb-Free) Shipping 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 10 NLAS5223B, NLAS5223BL PACKAGE DIMENSIONS WQFN10, 1.4x1.8x0.4P CASE 488AQ-01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. DIM A A1 A3 b D E e L L1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.050 0.20 REF 0.15 0.25 1.40 BSC 1.80 BSC 0.40 BSC 0.30 0.50 0.40 0.60 D A PIN 1 REFERENCE 2X 0.15 C 2X 0.15 C 0.10 C 0.08 C A1 A3 3 9X 5 6 1 L1 EEE EEE L e 10 10 X E B A SEATING PLANE C e/2 SOLDERING FOOTPRINT* 1.700 0.0669 0.663 0.0261 0.200 0.0079 9X 0.563 0.0221 b 0.10 C A B 0.05 C NOTE 3 1 2.100 0.0827 0.400 0.0157 PITCH 10 X 0.225 0.0089 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 NLAS5223B, NLAS5223BL PACKAGE DIMENSIONS 10 PIN UQFN, 1.4x1.8, 0.4P CASE 488AT-01 ISSUE O D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 b D E e L L3 MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.15 0.25 1.40 BSC 1.80 BSC 0.40 BSC 0.30 0.50 0.40 0.60 PIN 1 REFERENCE 2X 0.10 C 0.10 C 2X 0.05 C 0.05 C 10X 9X L 6 1 L3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative EEE EEE EEE A A1 3 5 10 10 X E B C SEATING PLANE SOLDERING FOOTPRINT* e/2 0.663 0.0261 0.10 C A B 0.05 C NOTE 3 1.700 0.0669 9X 0.563 0.0221 e 0.200 0.0079 1 b 2.100 0.0827 0.400 0.0157 PITCH 10 X 0.225 0.0089 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 NLAS5223B/D |
Price & Availability of NLAS5223BMUR2G
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |